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Section
Wafer Grinding




Component
Component: Wafer
Dimensions: Ø 2" - 12"
Material: Si, SiC, Sapphire (C-, A- and R-Plane), GaAs, GaN, etc.



Grinding Machine
Machine: Disco, Supfina, Okamoto, Strasbaugh, G&N, etc.
Grinding Op: thinning (rough- and fine grinding), backgrinding, reclaim grinding



Grinding Tool
Grinding Tool: rough grinding: 325 - 550 mesh
fine grinding: up to 8500 mesh



Results
Surface Finish Achieved: Ra 0.4 - Ra 0.015, depending on tool specification
Geometry Tolerances Achieved: TTV <2µm


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Home / Products / Case Studies / Face Grinding / Wafer Grinding 		Last Update: 21.04.2008
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